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发表于 2026-1-19 21:35:58
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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration
2 ~ l& P* x4 VTianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu 2 ]7 i( y' G/ ^4 Y+ s+ C& q) G- f, p
Microsystems & Nanoengineering volume 11, Article number: 25 (2025) * O5 T* ?& C- s
& B) X8 ?/ T/ t3 n5 a0 whttps://www.nature.com/articles/s41378-024-00797-z
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Sheng Liu
V4 M! a; {9 J0 ]6 H( r1 `School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China7 x7 o7 v. j2 o' I' D
School of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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