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发表于 2026-1-19 21:35:58
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Study of the protrusion of through-silicon vias in dual annealing-CMP processes for 3D integration( @8 K4 ` ^2 Z
Tianjian Liu, Shizhao Wang, Fang Dong, Yang Xi, Yunpeng Zhang, Tao He, Xiang Sun & Sheng Liu * p2 N* w* A! a" A( E
Microsystems & Nanoengineering volume 11, Article number: 25 (2025) ! o! r6 [9 j) y$ W
0 p I2 Q1 A5 ]https://www.nature.com/articles/s41378-024-00797-z7 Y; S9 K# ? d
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Sheng Liu7 t) B5 W& C* `# w- W8 s! [
School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China
: [7 @ | p% _, @. S9 W6 c9 B. h7 ^School of Power and Mechanical Engineering, Wuhan University, Wuhan, China |
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